DuPont has been named the winner of two R&D 100 Awards for advancements in science and innovation. The R&D 100 Awards, sponsored by R&D World magazine, recognizes the 100 most innovative technologies of the previous year.
“Congratulations to the DuPont Finalists and Winners of the 2019 R&D 100 Awards; all of us at DuPont are extremely proud of the innovation and ingenuity your teams contribute every day,” said Alexa Dembek, chief technology & sustainability officer for DuPont. “Innovation is a team sport at DuPont, and these awards exemplify DuPont’s culture of outcomes-driven research and willingness to translate cutting-edge thinking into customer impact.”
The 2019 R&D 100 award-winning DuPont technologies are:
GREAT STUFF SMART DISPENSER: An solution to make air sealing easier, more precise and with less product waste, the Great Stuff Smart Dispenser provides no drip, less mess and greater control, with a dispenser that is reusable for up to 30 days. It was designed to specifically respond to customer pain points over precision, mess and reusability. With the use of the Great Stuff, customers can seal air drafts, lower energy costs and prevent moisture buildup – all with a more efficient and effective dispensing mechanism.
Thermally conductive and emissive PBT resin for heatsink applications:DuPont Crastin FR1301TC BK350 was developed as thermally conductive resin to replace aluminum heatsink for lightweight and high heat emissivity in high-power LED housing. This material also can be applied as a general heatsink in various uses for the electrical and electronics markets and in automotive applications such as electronic component units.
In addition, the following four technologies were named as finalists:
Hytrel HTR 8808 BK316: Beyond 3D blow molding processability, DuPont Hytrel HTR8808 BK316 can be extruded to ultra-thin wall thicknesses down to 0.2 mm in processes for wire and cable, optical fiber extrusion or tubing. The flexibility, combined with
Hytrel HTR 8895 BK320: DuPont developed Hytrel® HTR 8895 BK320 as a solution proven to offer substantial long-term squeak-free performance in a variety of axle and joint designs under severe testing and testing protocols.
DuPont Zytel Fiber-Reinforced Filaments for 3D Printing: DuPont developed reinforced polyamide resins for additive manufacturing that exhibit a combination of low curl/warpage, low moisture absorption, and high modulus and strength of both dry and conditioned printed parts.
EKC CuSolve 590 Post-Etch Residue Remover: DuPont™ EKC CuSolve 590 is a first-of-its-kind post-etch residue remover (PERR) used by leading-edge chipmakers in the semiconductor fabrication process to enable reliable copper interconnects at their most advanced technology nodes. These integrated circuits are used in high-performance applications, including advanced 5G-compatible smartphones and other mobile devices.
Over the past eight years DuPont has received 13 R&D 100 Awards and been named as a finalist 17 times.
Since 1963, the R&D 100 Awards have identified revolutionary technologies newly introduced to the market. Widely recognized as the “Oscars of Invention,” the R&D 100 Awards identify and celebrate the top technology products and services of the year.